YXC75D Series

0R1

0.1

A

B

C

D

250V

2R4

2.4

A

B

C

D

250V

200

20

F
G
J
K

250V

0R2

0.2

2R7

2.7

220

22

0R3

0.3

3R0

3.0

240

24

0R4

0.4

3R3

3.3

270

27

0R5

0.5

3R6

3.6

300

30

0R6

0.6

3R9

3.9

330

33

0R7

0.7

4R3

4.3

360

36

0R8

0.8

4R7

4.7

390

39

0R9

0.9

5R1

5.1

430

43

1R0

1.0

5R6

5.6

470

47

1R1

1.1

6R2

6.2

510

51

1R2

1.2

6R8

6.8

B

C

J

K

560

56

1R3

1.3

7R5

7.5

620

62

1R4

1.4

8R2

8.2

680

68

1R5

1.5

9R1

9.1

750

75

1R6

1.6

100

10

F
G
J
K

820

82

1R7

1.7

110

11

910

91

1R8

1.8

120

12

101

100

1R9

1.9

130

13

121

120

2R0

2.0

150

15

151

150

2R1

2.1

160

16

181

180

2R2

2.2

180

18

201

200

Quality Factors(Q)

2000 min.

Insulation Resistance(IR)

105 Megohms min. @ +25°C at rated WVDC. 104 Megohms min. @ +125°C at rated WVDC.

Rated Voltage(WVDC)

250V

Dielectric Withstanding Voltage (DWV)

250% of rated Voltage for 5 seconds.

Operating Temperature Range

－55℃ to +125℃

Temperature Coefficient(TC)

0±30ppm/℃

Capacitance Drift

±0.02% or ±0.02pF, whichever is greater.

Piezoelectric Effects

None

Terminal Adhesion

Temrination should not pull off,      Cemera should remain undamaged

Linear pull force exerted on axial leads soldered to each terninal 2.0lbs

Resistance to soldering heat

No mechanical damage 

Capacitance change:-1.0%~+2.0%  

Q>500  I.R.>10 G Ohms 

 breakdown voltage:2.5 X WVDC

Preheat device to 150°C-180°C for 60sec DIP in 260°C±5°C solder for 10±1 sec.Measure after 24±2 hours cooling period

Thermal Shock

No mechanical damage 

Capacitance change:±5% or 0.5pF max 

Q>500 I.R.>10 G ohms

breakdown voltage:2.5 X WVDC

MIL-STD-202, Method 107, Condition A.  At the maximum rated temperature(-55℃ and 125℃) stay 30 minutes.The time of removing shall be not more than 3 minutes. Perform the five cycles.

Humidity  （steady state）

No mechanical damage 

Capacitance change:±5% or 0.5pF max  

Q>300      I.R.>10 G ohms

 breakdown voltage:2.5 X WVDC

MIL-STD-202.Method 106

Low voltage hummidity

No mechanical damage

Capacitance change:±3% or 0.3pF max   Q>300  I.R.>10 G ohms            breakdown voltage:2.5 X WVDC

MIL-STD-202, Method 103, Condition A, with 1.5 Volts D.C. applied while subjected to an environment of 85°C with 85% relative humidity for 240 hours min.

Life

No mechanical damage                  Capacitance change:±2% or 0.5pF max   Q>500    I.R.>10 G ohms  breakdown voltage:2.5 X WVDC

MIL-STD-202, Method 108, for 1000 hours, at 125℃.   

200% Rated voltage D.C. applied.

Chip Dimension

0.080 (2.0)

0.050(1.20)

0.057(1.45)